Job Description
Laser Packaging Engineer
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Santa Barbara / Goleta, CA
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I’m working with a rapidly scaling advanced hardware and engineering company looking to hire a Senior Laser Packaging Engineer to take ownership of its high power semiconductor laser packaging capability.
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This is a hands-on technical leadership role with a broad mandate; build the packaging platform, stand up the cleanroom, develop the processes, and build the team that takes devices from wafer/bar level through to reliable packaged hardware.
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The role will own:
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• High-power laser packaging across die attach, solder processes, wire bonding, subcarriers and thermal stack-ups
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• Packaging process development, qualification and reliability
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• Cleanroom buildout, including equipment selection, installation and qualification
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• Thermal management and package design for high-power laser devices
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• Building and leading a team of packaging engineers and technicians
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• Moving packaging from R&D/prototype builds toward repeatable production
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• Working closely with device, materials, test and reliability engineering teams
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Key experience:
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• Strong hands-on semiconductor or laser packaging background
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• High-power laser bars, VCSEL, PCSEL or closely related photonic devices
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• Die attach, wire bonding, solder/reflow and subcarrier design
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• Thermal modeling and high-heat-flux packaging
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• Packaging process development and qualification
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• Experience taking hardware from prototype into repeatable production
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• Previous technical/team leadership experience strongly preferred
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This is an opportunity to own the function rather than inherit a mature process. You’ll have responsibility for building the packaging capability, infrastructure and team around a new generation of high power photonic devices.
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Santa Barbara / Goleta, CA. Onsite position, with some flexibility for hybrid model.
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Full-time direct hire only; no C2C. Candidates must qualify as a U.S. Person under ITAR requirements.